Just a handful of delegate places are still available for IAM’s unique one day event focusing on the ways in which the EU unitary patent and Unified Patent Court (UPC) will affect the IP strategies of US companies that operate in Europe, and how they should prepare for the new regime.
Taking place on 18th February at the Golden Gate Club in San Francisco, Inside Europe’s New Patent Market boasts a world-class speaking faculty, with senior representatives from the likes of the European Patent Office, Google, Microsoft, IBM, Nokia and Ericsson taking part, alongside a number of leading European-based private practice lawyers, attorneys and intermediaries.
Last month, Finland became the ninth EU member state to ratify the UPC agreement, meaning just four more – including Germany and the UK – have to do the same before the new system can get up and running. Current indications are that everything will be done and dusted by the end of the year.
The launch of the EU unitary patent and the UPC will create a single jurisdiction encompassing four G8 economies and a total population of more than 420 million. It is likely to reduce costs and increase certainty on the continent, but not only that: Europe is set to become a much more active international patent litigation venue, while the value of European patents is sure to rise.
The impact on all companies, aggregators, intermediaries and other service providers that do business in Europe will be profound. Not only will the new system present a series of potential risks and strategic challenges to be planned for, but it will also offer a range of exciting opportunities. One thing is absolutely certain – these developments cannot be ignored.
No other conference taking place in the United States on the EU unitary patent and UPC provides the opportunity to access the level of expertise offered by Inside Europe’s New Patent Market. With under two weeks to go until the event takes place and remaining delegate places very limited, you can secure your attendance by registering here.