Samsung on top for 3D integrated circuit patents, as growth shifts east 05 Jul 18
The US leads by number of applications for three-dimensional integrated circuit (3D IC) patents but it is set to be overtaken by Asia if current growth trends continue, an exclusive analysis for IAM has revealed. Meanwhile, Samsung dominates in this crucial subsector of the semiconductor market by number of applications, and Japan’s Semiconductor Energy Laboratory takes the crown for the highest-quality portfolio.
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